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this is information on a product in full production . september 2014 docid026514 rev 3 1/17 MP34DT01-M mems audio sensor omnidirectional digital microphon e datasheet - production data features single supply voltage low power consumption 120 dbspl acoustic overload point 61 db signal-to-noise ratio omnidirectional sensitivity C 26 dbfs sensitivity pdm output hclga package C top-port design C smd-compliant C emi-shielded C ecopack ? , rohs, and green compliant applications mobile terminals laptop and notebook computers portable media players voip speech recognition a/v elearning devices gaming and virtual reality input devices digital still and video cameras antitheft systems description the MP34DT01-M is an ultra-compact, low- power, omnidirectional, digital mems microphone built with a capacitive sensing element and an ic interface. the sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process dedicated to produce audio sensors. the ic interface is manufactured using a cmos process that allows designing a dedicated circuit able to provide a digital signal externally in pdm format. the MP34DT01-M has an acoustic overload point of 120 dbspl with a 61 db signal-to-noise ratio and C26 dbfs sensitivity. the MP34DT01-M is available in a top-port, smd- compliant, emi-shielded package and is guaranteed to operate over an extended temperature range from -40 c to +85 c. hclga (3 x 4 x 1.06 4ld) table 1. device summary order codes temperature range [c] package packing MP34DT01-M -40 to +85 hclga (3 x 4 x 1.06) mm 4ld tray mp34dt01tr-m tape and reel www.st.com
contents MP34DT01-M 2/17 docid026514 rev 3 contents 1 pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 acoustic and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 acoustic and electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.2 frequency response . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.3 timing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3 application recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 4 sensing element . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 5 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 6 functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 6.1 l/r channel selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 7 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 8 carrier tape mechanical specifications . . . . . . . . . . . . . . . . . . . . . . . . . 14 9 process recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 10 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
docid026514 rev 3 3/17 MP34DT01-M pin description 17 1 pin description figure 1. pin connections table 2. pin description pin # pin name function 1 vdd power supply 2 lr left/right channel selection 3 clk synchronization input clock 4 dout left/right pdm data output 5 (ground ring) gnd 0 v supply %277209,(: /5 9gg &/. '287 *1' *$066*
acoustic and electrical specifications MP34DT01-M 4/17 docid026514 rev 3 2 acoustic and electrical specifications 2.1 acoustic and electrical characteristics the values listed in the table below are specified for vdd = 1.8 v, clock = 2.4 mhz, t = 25 c, unless otherwise noted. table 3. acoustic and electrical characteristics symbol parameter test condition min. typ. (1) 1. typical specifications are not guaranteed. max. unit vdd supply voltage 1.64 1.8 3.6 v idd current consumption in normal mode mean value 0.6 ma iddpdn current consumption in power-down mode (2) 2. input clock in static mode. 20 a scc short-circuit current 1 10 ma aop acoustic overload point 120 dbspl so sensitivity -29 -26 -23 dbfs snr signal-to-noise ratio a-weighted at 1 khz, 1 pa 61 db psr power supply rejection guaranteed by design -70 dbfs clock input clock frequency (3) 3. duty cycle: min = 40% max = 60%. 1 2.4 3.25 mhz ton turn-on time (4) 4. time from the first clock edge to valid output da ta. guaranteed by design 10 ms top operating temperature range -40 +85 c v iol low level logic input/output voltage i out = 1 ma -0.3 0.35xvdd v v ioh high level logic input/output voltage i out = 1 ma 0.65xvdd vdd+0.3 v table 4. distortion specifications parameter test condition value distortion 100 dbspl (1 khz) < 1% thd+n distortion 115 dbspl (1 khz) < 2% thd+n distortion 120 dbspl (1 khz) < 10% thd+n
docid026514 rev 3 5/17 MP34DT01-M acoustic and electrical specifications 17 2.2 frequency response figure 2. typical frequency response normalized at 1 khz
acoustic and electrical specifications MP34DT01-M 6/17 docid026514 rev 3 2.3 timing characteristics figure 3. timing waveforms table 5. timing characteristics parameter description min. max. unit f clk clock frequency for normal mode 1 3.25 mhz f pd clock frequency for power-down mode 0.23 mhz t clk clock period for normal mode 308 1000 ns t r,en data enabled on data line, l/r pin = 1 18 (1) 1. from design simulations ns t r,dis data disabled on data line, l/r pin = 1 16 (1) ns t l,en data enabled on data line, l/r pin = 0 18 (1) ns t l,dis data disabled on data line, l/r pin = 0 16 (1) ns high z high z high z high z t l,en r,dis r,en t l,dis t t t clk am045165v1 clk pdm r pdm l
docid026514 rev 3 7/17 MP34DT01-M application recommendations 17 3 application recommendations figure 4. MP34DT01-M electrical connections (top vi ew) figure 5. MP34DT01-M electrical connections for ste reo configuration (top view) *$066* &2'(& &/. 'rxw /5 ?) q) 9gg *urxqgulqj *$066* &2'(& 'rxw ?) q) 9gg &/. 'rxw *urxqgulqj 9gg
application recommendations MP34DT01-M 8/17 docid026514 rev 3 power supply decoupling capacitors (100 nf ceramic, 10 f ceramic) should be placed as near as possible to pin 1 of the device (common des ign practice). the l/r pin must be connected to vdd or gnd (refer to table 5 ).
docid026514 rev 3 9/17 MP34DT01-M sensing element 17 4 sensing element the sensing element shall mean the acoustic sensor consisting of a conductive movable plate and a fixed plate placed in a tiny silicon ch ip. this sensor transducers the sound pressure into the changes of coupled capacity betwe en those two plates. omron corporation supplies this element for stmicro electronics.
absolute maximum ratings MP34DT01-M 10/17 docid026514 rev 3 5 absolute maximum ratings stresses above those listed as absolute maximum ra tings may cause permanent damage to the device. this is a stress rating only and fun ctional operation of the device under these conditions is not implied. exposure to maximum rati ng conditions for extended periods may affect device reliability. table 6. absolute maximum ratings symbol ratings maximum value unit vdd supply voltage -0.3 to 6 v vin input voltage on any control pin -0.3 to vdd +0.3 v t stg storage temperature range -40 to +125 c esd electrostatic discharge protection 2 (hbm) kv 3 discharges at 8 kv direct contact to lid when un it is grounded (iec 61000-4-2) and 3 discharges at 2 kv direct contact to i/o pins. (mil 883e, method 3015.7) 8 kv this device is sensitive to mechanical shock, impro per handling can cause permanent damage to the part. this device is esd-sensitive, improper handling can cause permanent damage to the part.
docid026514 rev 3 11/17 MP34DT01-M functionality 17 6 functionality 6.1 l/r channel selection the l/r digital pad lets the user select the dout s ignal pattern as shown in table 7 . the l/r pin must be connected to vdd or gnd. table 7. l/r channel selection l/r clk low clk high gnd data valid high impedance vdd high impedance data valid
package mechanical data MP34DT01-M 12/17 docid026514 rev 3 7 package mechanical data in order to meet environmental requirements, st off ers these devices in different grades of ecopack ? packages, depending on their level of environmenta l compliance. ecopack ? specifications, grade definitions and product statu s are available at: www.st.com . ecopack ? is an st trademark. soldering information the hclga 3x4 4ld package is also compliant with th e rohs and green standards and is qualified for soldering heat resistance accordin g to jedec j-std-020. landing pattern and soldering recommendations are a vailable at www.st.com . figure 6. recommended soldering profile limits table 8. recommended soldering profile limits description parameter pb free average ramp rate t l to t p 3 c/sec max preheat minimum temperature maximum temperature time (t smin to t smax ) t smin t smax t s 150 c 200 c 60 sec to 120 sec ramp-up rate t smax to t l time maintained above liquidus temperature liquidus temperature t l t l 60 sec to 150 sec 217 c peak temperature t p 260 c max time within 5 c of actual peak temperature 20 sec t o 40 sec ramp-down rate 6 c/sec max time 25 c (t25 c) to peak temperature 8 minutes max t25 c to peak ramp-down ramp-up t s preheat t l t p cr itical zone t l to t p t smax t smin time t p t l tem pe rat ur e 30 60 90 120 150 180 210 240 270 300 330 360 390 am045166v1
docid026514 rev 3 13/17 MP34DT01-M package mechanical data 17 figure 7. hclga (3 x 4 x 1.06 mm) 4-lead package ou tline note: the mems microphone metal cap can exhibit some level of variation in color when the device is subjected to thermal process. dimensions are in millimeter unless otherwise speci fied. general tolerance is 0.15 mm unless otherwise specified. 32$bb$ table 9. hclga (3 x 4 x 1.06 mm) mechanical data item dimension (mm) tolerance (mm) length [l] 4 0.1 width [w] 3 0.1 height [h] 1.06 0.1
carrier tape mechanical specifications MP34DT01-M 14/17 docid026514 rev 3 8 carrier tape mechanical specifications figure 8. carrier tape without microphone-top view figure 9. carrier tape with microphone-top view
docid026514 rev 3 15/17 MP34DT01-M process recommendations 17 9 process recommendations to ensure a consistent manufacturing process it is strongly advised to comply with following recommendations: C the recommended pick-up area for the MP34DT01-M pa ckage must be defined using the worst case (ie. no device alignment durin g picking process). this area has been defined considering all the tolerances of the components involved (reel, package, sound inlet). picker tolerance shall be co nsidered as well. C to prevent damage to the mems membrane or incorrec t pick-up and placement, do not pick up the component on the inlet area C for the package outline please refer to figure 10 . nozzle shape, size, and placement accuracy are the other key factors to con sider when deciding on the coordinates for the picking. C device alignment before picking is highly recommen ded. C a vacuum force greater than 7 psi must be avoided C 1 kpa = 0.145 psi (lb/in2) = 0.0102 kgf/cm2 = 0.00 98 atm C all the recommended dimensions (device safe pick a rea) do not include the pick and place equipment tolerances C according to figure 10 , standard picker tool can be used to handle this d evice figure 10. recommended picking area gams3107141420sg 2.27 pocket size clearance sound port positional tolerance safe pick area pocket positional tolerance package size tolerance 1.245 0.58 1.99 radius of package corner (0.25 mm) 0.285 1.49 0.23 0.96
revision history MP34DT01-M 16/17 docid026514 rev 3 10 revision history table 10. document revision history date revision changes 19-jun-2014 1 initial release 09-jul-2014 2 modified min. and max. values so paramet er table 3 on page 4 03-sep-2014 3 added: C table 4: distortion specifications on page 4 C section 3: application recommendations on page 7 C section 9: process recommendations on page 15
docid026514 rev 3 17/17 MP34DT01-M 17 important notice C please read carefully stmicroelectronics nv and its subsidiaries (st) r eserve the right to make changes, corrections, enha ncements, modifications, and improvements to st products and/or to this document at any time without notice. purchasers should obta in the latest relevant information on st products before placing orders. st products are sold pursuant to sts terms and conditions of sale in place at the time of order acknowledgement. purchasers are solely responsible for the choice, s election, and use of st products and st assumes no liability for application assistance or the design of purchasers products. no license, express or implied, to any intellectual property right is granted by st herein. resale of st products with provisions different fro m the information set forth herein shall void any w arranty granted by st for such product. st and the st logo are trademarks of st. all other product or service names are the property of their respective owners. information in this document supersedes and replace s information previously supplied in any prior vers ions of this document. ? 2014 stmicroelectronics C all rights reserved

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